Development of Halogen Free, Low Loss Copper-Clad Laminates Containing a Novel Phosphonate Oligomer

 

With the rapid development of the information industry, increasing attention is being paid to the dielectric performance of base materials including copper-clad laminates (CCL) and prepregs.  In addition to the increasingly high performance requirements of CCL’s, the present global attention to less toxic products is leading to an increase in the use of halogen-free flame retardants in electronics.  The significance of this paper is not only to introduce a new halogen-free, mid-TG, low loss CCL, but also to highlight a novel kind of halogen free reactive flame retardant for CCL.

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Eric Readinger